Microsoft PowerPoint - PCB_Design_Bga0-5rt_modified.ppt Semiconductor Products Sector 1 - 8/18/99 1&6' Top Surface Footprint Plated Thru Hole via 0.1 mm line (4 mil), and 0.1 mm spaces Solder Joining
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Microsoft PowerPoint - PCB_Design_Bga0-5rt_modified.ppt Semiconductor Products Sector 1 - 8/18/99 1&6' Top Surface Footprint Plated Thru Hole via 0.1 mm line (4 mil), and 0.1 mm spaces Solder Joining
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