SOT1882-1 WL CS P47 SOT1882-1 wafer level chip-scale package; 47 bumps; 3.20 mm x 3.28 mm x 0.365 mm body 20 March 2018 Package information 1. Package summary Terminal position code B (bottom
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SOT1882-1 WL CS P47 SOT1882-1 wafer level chip-scale package; 47 bumps; 3.20 mm x 3.28 mm x 0.365 mm body 20 March 2018 Package information 1. Package summary Terminal position code B (bottom
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